1. Kev sau npe tsis raug: "Millimeter-kev sib tw" ntawm ntau- txheej txheej. Ntau - cov ntawv lo yuav tsum tau luam tawm ib txhij ntawm cov ntaub ntawv sib txawv nrog kev sib raug zoo. Misalignment ntawm ib txheej yuav cuam tshuam kev nyeem ntawv thiab kev paub.
Cov khoom siv tsis raug: Cov ntawv sau npe yuam kev ntawm ib chav tsev - hom flexographic luam ntawv xovxwm yog kwv yees li ± 0.2 hli, siab dua li ntawm satellite - hom xovxwm (± 0.08mm), ua rau nws nyuaj kom ua tau raws li qhov siab - qhov yuav tsum tau ua.
Cov ntaub ntawv deformation: Tus kheej- cov ntawv nplaum muaj ntau- txheej txheej txheej, uas yooj yim nthuav thiab sib cog lus los ntawm qhov kub thiab av noo, ua rau tsis ruaj tsis khov thiab cov ntawv sib txawv thaum luam ntawv.
Kev daws: Siv lub tshuab sau npe hauv hluav taws xob kom paub tseeb- lub sijhawm tshawb nrhiav thiab them nyiaj, tswj kev ua haujlwm kub thiab av noo, thiab ntsuas qhov kev txiav txim siab siv lub iav tsom iav siab -.
2. Tsis sib haum ntawm cov khoom nro thiab lub zog saum npoo: Ink smudging thiab adhesion tsis ua hauj lwm.
Low surface tension: The surface tension of film materials such as PE and PET is often below 38 dynes, making it difficult for ink to wet, easily resulting in white spots, ink shrinkage, and ink smudging.
Ink Matching nyuaj nyuaj: Ordinary UV inks tsis tuaj yeem ua raws li siab - kub resistant substrates (xws li polyimide), yuav tsum tau tshwj xeeb siab - kub inks, uas yog kim thiab muaj tsawg xaiv xim.
Kev daws: Ua kev kho mob corona ua ntej luam ntawv txhawm rau txhim kho lub zog saum npoo, lossis xaiv cov tshuaj pleev xim; ua me me - ntsuas ntsuas ua ntej kev tsim khoom kom ntseeg tau adhesion.
3. Lamination txheej txheem deviations: Uncontrolled Interlayer Adhesion
Cov Txheej Txheem Hauv Ib Cheeb Tsam tsis raug: Yog tias cov nplaum txheej txheej tsis raug, nws tuaj yeem ua rau adhesion nyob rau hauv tsis yog - cov hom phiaj, cuam tshuam rau txheej txheej - los ntawm - txheej txheej txheej txheej.
Tsis sib xws Adhesive Curing: Tsis txaus UV curing qhov tob los yog kev tswj qhov kub tsis zoo tuaj yeem ua rau cov nplaum nplaum tsis zoo los yog dhau heev, ua rau delamination thaum siv.
Kev pom zoo: Siv lub siab- txheej txheej lub taub hau los tswj cov nplaum nplaum, ua online UV curing, thiab saib xyuas lub zog tawm hauv lub sijhawm.
4. Tuag-Txiav thiab pov tseg cov kev sib tw: Tsis meej pem ntawm ib nrab-Txiav thiab puv-Txiav
Complex Multi-Layer Structures: Ib nrab-txiav (txiav tsuas yog lub ntsej muag daim ntawv) thiab tag nrho -txiav (xws li ntau txheej) yuav tsum tau ua tiav nyob rau hauv tib txoj kev, yuav tsum tau heev meej lub cuab tam qhov tob hloov.
Paper Break Risk: Tsis sib haum ntawm cov ntu thaum lub sij hawm rewinding tom qab inline tuag- txiav tuaj yeem ua rau cov ntawv tawg yooj yim, tshwj xeeb tshaj yog pom hauv daim ntawv nqaim.
Optimization Direction: Tsis tu ncua xyuas qhov hnav ntawm qhov tuag- txiav cov hniav, ua kom raug lub siab thiab shim thickness kom paub meej txiav zoo yam tsis muaj kev puas tsuaj rau daim ntawv thaub qab.
5. Kev tsis sib haum xeeb ntawm Kev Tiv Thaiv -kev ua pov thawj thiab cov ntaub ntawv digital kev sib koom ua ke:
Kev nyeem QR Code tsis zoo: Kev luam ntawv QR cov lej rau ntawm qhov chaw nkhaus lossis cov txheej txheem sib xyaw tuaj yeem yooj yim ua rau scanning tsis ua haujlwm vim muaj kev cuam tshuam.
RFID cuam tshuam: Hlau substrates los yog inks conductive yuav tiv thaiv xov tooj cua zaus signals, cuam tshuam rau kev nyeem ntawv nyob deb thiab stability.
Kev daws: Ua kom zoo tshaj tus kav hlau txais xov tsim kom tsis txhob muaj hlau, siv los tiv thaiv - cov chips cuam tshuam, thiab ua tiav kev tshuaj ntsuam xyuas tom qab luam ntawv.
